[PDF] Top 20 Interfacial Properties of Zn Sn Alloys as High Temperature Lead Free Solder on Cu Substrate

... the Zn–20Sn/Cu joint exhibits an interfacial ...the Zn–40Sn alloy, in which -Sn/-Zn eutectic phase seem to play a key role for deformation, should contribute the lower strength ... See full document

... 3.1 Wetting behavior of solders on Cu substrate Figure 1 shows the wetting time and wetting force of Sn- 8.55Zn-0.45Al-(0-3)Ag solders on Cu substrate for various fluxes at 523K. Figure ... See full document

... contrast, Sn-Zn family solders have good mechanical property and equivalent melting temperature as the Sn-Pb eutectic ...However, Sn-Zn family solders have poor wettability on ... See full document

... melting temperature of solder, adequate strength, the environmental issues related to the toxicity, good electrical/thermal conduc- tivity, low cost, good wetting properties, and availability in ... See full document

... with Cu plates plotted against the thermal exposure ...the Cu–Sn compound. When the exposure temperature was 150 ◦ C, the formation of the Cu–Sn com- pound and the disappearance ... See full document

... liquidus temperature of the alloy specimen and held for 10–15 min at the aimed temperature to allow melting and homogenization of the ...the temperature range of 700–800 ...tal temperature ... See full document

... fatigue properties of lead-free solder alloys and the constants A and m were measured for the mode I crack propagation, no reports on the mode II crack ...the lead-free ... See full document

... Bi, Cu, In, Ag, Al, Ga, Sb, Cr, Ni, Ge elements to develop Pb free ...soldering properties (melting temperature and contact angle) and corrosion behavior of tin based lead free ... See full document

... The solder material used for soldering need to have acceptable properties of wettability, thermal behaviour, mechanical properties such as tensile strength and low ...regulations, Sn-Pb ... See full document

... many solder alloys, Sn–Pb solders are most widely used for the electronic ...Pb free solders such as Sn–Bi, Sn–Ag, Sn–Zn alloys, have been considered to ... See full document

... types Sn-Ag-Cu-Ni-Ge solder balls were prepared and ...and Sn-3.5 mass%Ag-0.5 mass%Cu solder balls were also prepared for ...of solder balls used in this study. The ... See full document

... Gibbs free energy for the oxidation reactions are expressed by ...Gibbs free energy, Zn is much more easily oxidized than ...measuring temperature range between 523 and 673 K, the saturated ... See full document

... materials properties, such as the coefficients of thermal expansion (CTEs) and the elastic moduli, were found to induce thermal ...good high temperature solders, which are used as die-attach materials, ... See full document

... the solder- ing ...in solder. Looking at the periodic table of ele- ments lead can be substituted in solders only by a few ele- ...new alloys should have a similar melting tem- perature as ... See full document

... of Sn-based lead-free solders such as ...solidus temperature of a Sn-based lead-free solder is approximately 220C, which is higher than that of a conventional ... See full document

... a Cu compound, demonstrates improved solder joint strength for solder ball attachment on electroless Ni–Au surface ...thin Cu–Sn intermetallic layer on the Ni–P plated surface is ... See full document

... immediately placed onto an isolation plate. Two thermocou- ples are inserted into the crucible; one at the center position and the other near the wall. The cooling curve is recorded by the data logger at a rate of 1 Hz. ... See full document

... a solder joint using Sn-3.5Ag-0.5Bi- 8In solder was then ...the Sn-3.5Ag-0.5Bi-8In solder under the same conditions is shown in ...of solder, indium was dispersed over the entire ... See full document

... other high-Sn, Pb-free ...the alloys in Table 5 indicated that the solid-state intermetallic compound layer growth was relatively insensi- tive to the widely different solder ... See full document

... The effect on the wetting curve is not significant because the addition amount of Ge is very trace, so choose the middle Ge content for the dipping test. Figure 3 shows the relation- ship between the wetting time and the ... See full document