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EE134 1

Digital Integrated Circuit (IC) Layout and Digital Integrated Circuit (IC) Layout and

Design Design

!

EE 134 – Winter 05

" Lecture Tu & Thurs. 9:40 – 11am ENGR2 142

" 2 Lab sections

– M 2:10pm – 5pm ENGR2 128 – F 11:10am – 2pm ENGR2 128

" NO LAB THIS WEEK

" FIRST LAB Friday Jan. 20

People People

!

Lecturer - Roger Lake

" Office – ENGR2 Rm. 437

" Office hours - MW 4-5pm

" [email protected]

!

TA – Faruk Yilmaz

" Office – ENGR2 Rm. 222

" Office Hours – TBD

" [email protected]

(2)

EE134 3

EE134 Web

EE134 Web - - site site

!

http://www.ee.ucr.edu/~rlake/EE134.html

" Class lecture notes

" Assignments and solutions

" Lab and project information

" Exams and solutions

" Other useful links

Class Organization Class Organization

!

Homework assignments (10%)

!

Labs (20%)

" Tutorials to learn the Cadence design software

!

Final Project (50%)

" Design a digital circuit (eg. 4 bit adder)

" Work in teams of 3

!

Midterm (20%)

(3)

EE134

Digital Integrated Digital Integrated Circuits:

Circuits:

A Design Perspective, A Design Perspective, 2 2

ndnd

Ed. Ed.

Jan M. Rabaey

Anantha Chandrakasan Borivoje Nikolic

Text Book Text Book

Software Software

!

Cadence software

" Online documentation and tutorials

" Sun4 UNIX Workstations

(4)

EE134 7

What is this book all about?

What is this book all about?

!

Introduction to digital integrated circuits.

" CMOS devices and manufacturing technology.

" CMOS inverters and gates.

" Propagation delay,

" noise margins, and

" power dissipation.

" Sequential circuits. Arithmetic, interconnect, and memories.

!

What will you learn?

" Understanding, designing, and optimizing digital circuits with respect to different quality metrics: cost, speed, power

dissipation, and reliability

Digital Integrated Circuits Digital Integrated Circuits

!

Introduction: Issues in digital design

!

CMOS devices and manufacturing

!

The CMOS inverter

!

Combinational logic structures

!

Propagation delay, noise margins, power

!

Sequential logic gates; timing

!

Interconnect: R, L and C

!

Arithmetic building blocks

!

Memories and array structures

!

Design methods

(5)

EE134 9

EE134 Winter 2006

EE134 Winter 2006 - - Lecture 1 Lecture 1

!

Introduction

Introduction Introduction

!

Why is designing digital ICs different today than it was before?

!

Will it change in future?

(6)

EE134 11

The First Computer (1832) The First Computer (1832)

The Babbage Difference Engine (1832)

25,000 parts cost: £17,470

ENIAC

ENIAC - - The first electronic computer (1946) The first electronic computer (1946)

(7)

EE134 13

The Transistor Revolution The Transistor Revolution

First transistor Bell Labs, 1948

The First Integrated Circuits The First Integrated Circuits

Bipolar logic 1960’s

ECL 3-input Gate Motorola 1966

(8)

EE134 15

Intel 4004 Micro

Intel 4004 Micro -Processor (1971) - Processor (1971)

1971

2,300 transistors 108 KHz operation

Intel Pentium 4 microprocessor (2000) Intel Pentium 4 microprocessor (2000)

42 M transistors (217 mm2)

1.5 GHz 0.18 µm

180 nm technology node

(9)

EE134 17

What Happened over 30 Years?

What Happened over 30 Years?

1971 2000

2,300 transistors 108 KHz operation

42 M transistors 1.5 GHz operation

~ 15,000 x

Automotive comparison: SF to NY in 13 seconds.

Moore

Moore s Law s Law

#

In 1965, Gordon Moore noted that the number of transistors on a chip doubled every 18 to 24 months.

#

He made a prediction that

semiconductor technology will double its

effectiveness every 18 months

(10)

EE134 19

Moore

Moore s Law s Law

1 6 1 5 1 4 1 3 1 2 1 1 1 0 9 8 7 6 5 4 3 2 1 0

1959 1960 1961 1962 1963 1964 1965 1966 1967 1968 1969 1970 1971 1972 1973 1974 1975

LOG2 OF THE NUMBER OF COMPONENTS PER INTEGRATED FUNCTION

Electronics, April 19, 1965.

Evolution in Complexity

Evolution in Complexity

(11)

EE134 21

Transistor Counts Transistor Counts

1,000,000 100,000 10,000 1,000

10 100

1

1975 1980 1985 1990 1995 2000 2005 2010 8086

80286 i386

i486Pentium®

Pentium®Pro

K 1 Billion 1 Billion

Transistors Transistors

Source: Intel Source: Intel

Projected Projected

Pentium®II Pentium®III

Courtesy, Intel

Moore

Moore s law in Microprocessors s law in Microprocessors

400480088080 8085 8086

286 386

486Pentium® procP6

0.001 0.01 0.1 1 10 100 1000

1970 1980 1990 2000 2010

Year

Transistors (MT)

2X growth in 1.96 years!

(12)

EE134 23

Die Size Growth Die Size Growth

40048008 8080

80858086286386 486 Pentium ® proc P6

1 10 100

1970 1980 1990 2000 2010

Year

Die size (mm) ~7% growth per year

~2X growth in 10 years

Die size grows by 14% to satisfy Moore’s Law Die size grows by 14% to satisfy Moore’s Law

Courtesy, Intel

Frequency Frequency

P6

Pentium ® proc 486

286 386 8085 8086

8080 8008 0.1 4004

1 10 100 1000 10000

1970 1980 1990 2000 2010

Year

Frequency (Mhz)

Lead Microprocessors frequency doubles every 2 years Lead Microprocessors frequency doubles every 2 years

Doubles every 2 years

(13)

EE134 25

Power Dissipation Power Dissipation

P6

Pentium ® proc 486

386 8086 286

80808085 40048008

0.1 1 10 100

1971 1974 1978 1985 1992 2000 Year

Power (Watts)

Lead Microprocessors power continues to increase Lead Microprocessors power continues to increase

Courtesy, Intel

Power will be a major problem Power will be a major problem

5KW 18KW 1.5KW 500W

40048008808080858086286

386486

Pentium® proc

0.1 1 10 100 1000 10000 100000

1971 1974 1978 1985 1992 2000 2004 2008 Year

Power (Watts)

Power delivery and dissipation will be prohibitive Power delivery and dissipation will be prohibitive

(14)

EE134 27

Power density Power density

4004 8008

8080 8085

8086

286 386

486

Pentium® proc P6

1 10 100 1000 10000

1970 1980 1990 2000 2010

Year

Power Density (W/cm2)

Hot Plate Nuclear Reactor Rocket Nozzle

Power density too high to keep junctions at low temp Power densitytoo high to keep junctions at low temp

Courtesy, Intel

Not Only Microprocessors Not Only Microprocessors

Digital Cellular Market (Phones Shipped)

Analog Baseband

Digital Baseband (DSP + MCU)

Power Management Small

Signal RF Power RF

Cell Phone

(889) (836)

(776) (703)

648 513

435 162 48 Units (M)

2008 2007

2006 2005

2004 2003

2000 1998 1996 Year

(15)

EE134 29

Challenges in Digital Design Challenges in Digital Design

“Microscopic Problems”

• Ultra-high speed design

• Interconnect

• Noise, Crosstalk

• Reliability, Manufacturability

• Power Dissipation

• Clock distribution.

Everything Looks a Little Different

“Macroscopic Issues”

• Time-to-Market

• Millions of Gates

• High-Level Abstractions

• Reuse & IP: Portability

• Predictability

• etc.

…and There’s a Lot of Them!

∝ (

# Transistors)

∝ 1/(Transistor size)

?

Productivity Trends Productivity Trends

1 10 100 1,000 10,000 100,000 1,000,000 10,000,000

2003

1981 1983 1985 1987 1989 1991 1993 1995 1997 1999 2001 2005 2007 2009

10 100 1,000 10,000 100,000 1,000,000 10,000,000 100,000,000 Logic Tr./Chip

Tr./Staff Month.

x x x x x x

x

21%/Yr. compound Productivity growth rate

x

58%/Yr. compounded Complexity growth rate 10,000

1,000 100 10 1 0.1 0.01 0.001 Logic Transistor per Chip(M)

0.01 0.1 1 10 100 1,000 10,000 100,000

Productivity (K) Trans./Staff -Mo.

Source: Sematech

Complexity outpaces design productivity

Complexity

(16)

EE134 31

Why Scaling?

Why Scaling?

!

Technology shrinks by 0.7/generation

!

With every generation can integrate 2x more functions per chip; chip cost does not

increase significantly

!

Cost of a function decreases by 2x

!

But …

" How to design chips with more and more functions?

" Design engineering population does not double every two years…

!

Hence, a need for more efficient design methods

" Exploit different levels of abstraction

Design Abstraction Levels Design Abstraction Levels

n+

n+

S

G

D +

DEVICE CIRCUIT GATE MODULE SYSTEM

(17)

EE134 33

Next Class Next Class

!

Introduce basic metrics for design of

integrated circuits – how to measure delay, power, etc.

!

Introduction to IC manufacturing and

design.

References

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