Pb-Sn solder joints
Effects of Thermal Storage and Cu Addition on Adhesive Strength and Microstructure of Sn 3 0 mass% Ag 1 5 mass% Sb xCu Solder Joints
... now recognized as hazardous materials and having a severely detrimental effect on the human body and the environment. As a consequence, an increasing number of countries have passed laws to eliminate the use of ...
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Sn Ag Based Solders Bonded to Ni P/Au Plating: Effects of Interfacial Structure on Joint Strength
... eutectic Sn-Pb solder, which is commonly used, is environ- mentally harmful and can potentially affect human ...eutectic Sn-Pb solder are the Sn-Ag based ...eutectic ...
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Interfacial Reactions in Sn 57Bi 1Ag Solder Joints with Cu and Au Metallization
... of Sn-based lead-free solders such as ...a Sn-based lead-free solder is approximately 220C, which is higher than that of a conventional eutectic Sn-Pb ...
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Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn 3 5Ag 0 75Cu Solder
... Sn intermetallics caused embrittlement in BGA joints. How- ever, Au was not found remaining at the interface of the BGA pad and solder ball due to the limited spatial resolution of the SEM. A ...
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Fatigue Reliability Evaluation for Sn Zn Bi and Sn Zn Lead Free Solder Joints
... of Sn–37Pb eutectic solder with the fatigue strength of Sn–Zn–(Bi) solder, the authors carried out a mechanical fatigue test for ...treated Sn–37Pb solder decreases a little in ...
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Transmission Electron Microscopy of Interfaces in Joints between Pb Free Solders and Electroless Ni P*
... a solder joint of Sn–Ag–Cu–Bi/ Ni–P, at a low magnification, and concentration profiles of P, Ni, Cu, Ag, Bi and Sn, obtained at points 1–16 by EDX analysis, across the joint, ...5–8), Sn ...
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Temperature Effect on Tensile Behaviour of Sn Pb Eutectic Solder
... though solder materials are evolving to be lead-free as legislated by RoHS [1,2], tin/lead (Sn-Pb) eutectic solder materials are still widely applied in the defense and aerospace industries ...
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Interfacial Reaction and Mechanical Characterization of Eutectic Sn Zn/ENIG Solder Joints during Reflow and Aging
... case of Sn–Pb and Sn–Ag solders. As shown in Fig. 1, Au did not dissolve into the solder. Instead, due to the fast reaction of Au and Zn, an Au–Zn phase formed at the interface. Because Au and ...
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The Microstructure, Thermal Fatigue, and Failure Analysis of Near Ternary Eutectic Sn Ag Cu Solder Joints
... to Pb-free soldering in the near ...candidate Pb-free solders are near-ternary eutectic Sn-Ag-Cu ...eutectic Sn-Ag-Cu alloys has been reported in terms of the formation of large Ag 3 Sn ...
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Properties of Solder Joints Using Sn Ag Bi In Solder
... Sn-3.5Ag-0.5Bi-3In, Sn-3Ag-2.5Bi-2.5In, Sn-3.5Ag-0.5Bi-8In, and Sn-8Zn-3Bi, with Sn-37Pb used as the reference solder(all compositions are expressed in mass ...Each solder ...
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Anomalous Creep in Sn Rich Solder Joints
... example Sn-rich solders that have become candidates for use in Pb-free solder ...Sn–3Ag–0.5Cu, Sn–0.7Cu and Sn–10In–3.1Ag, used in thin joints between Cu and Ni/Au ...
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Acoustic Microscopy of Interfacial Crack in Sn Ag Cu Alloy Solder Joints under Shear Fatigue Testing
... lead, solder materials for electronic products have been replaced from Pb-Sn alloys to lead-free ...the solder joints, and finally to result in ...lead-free solder 1–13) and ...
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Effect of Zn Addition on Interfacial Reactions Between Sn Bi Solder and Cu Substrate
... eutectic Sn-Bi solder. To evaluate the interfacial IMC between Sn-Bi-Zn and the Cu substrate, ele- mental-mapping analysis was performed using EPMA and the results are shown in ...the Sn-Bi-Zn ...
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Effect of Corrosion on Mechanical Reliability of Sn Ag Flip Chip Solder Joint
... of solder bump due to corrosion was observed near the pad edge as indicated by a blue arrow in the ...the solder bump and induced the shear strength drop during bump shear ...
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Cu6Sn5 Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer
... 12. Kang, S.K.; Lauro, P.; Shih, D.Y.; Henderson, D.W.; Gosselin, T.; Bartelo, J.; Cain, S.R.; Goldsmith, C.; Puttlitz, K.J.; Hwang, T.K. Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu ...
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Thermodynamics Aided Alloy Design and Evaluation of Pb free Solders for High Temperature Applications
... as-cast Sn–5Sb and Sn–10Sb alloys. While the β - Sn matrix was observed without a secondary phase in Sn– 5Sb, the distribution of secondary particles was observed in ...as-cast Sn–5Sb ...
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Joining of Copper Plates by Unusual Wetting with Liquid Tin and Tin Lead Solder on “Surface Fine Crevice Structure”
... the joint experiment. A 10 × 12 mm area on the 15 × 15 mm plate and the entire area on the 10 × 10 mm plate were irradi- ated by laser under the same conditions as the wetting exper- iments. As shown in Fig. 6, the ...
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Interfacial Reaction between Sn Ag Co Solder and Metals
... between Sn–Ag–Cu solder and plated iron to revel the effect of iron-plating conditions on reactions in molten ...lead-free solder was largely attributable to the grain size of the plated surface and ...
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Impact Properties of Lead Free Sn Ag Cu Ni Ge Solder Joint with Cu Electrode
... types Sn-Ag-Cu-Ni-Ge solder balls were prepared and ...and Sn-3.5 mass%Ag-0.5 mass%Cu solder balls were also prepared for ...of solder balls used in this study. The diameter of each ...
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Recovery of Sn, Ag and Cu from Waste Pb Free Solder Using Nitric Acid Leaching
... To precipitate Ag ions from the leach solution, the additions of NaCl or Cu powder were investigated. The addition of 2 kg·m ¹ 3 of NaCl could remove 3755 g·m ¹ 3 of Ag successfully. In the cementation process with Cu ...
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