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Sn-Ag-In solder

Properties of Solder Joints Using Sn Ag Bi In Solder

Properties of Solder Joints Using Sn Ag Bi In Solder

... a solder joint using Sn-3.5Ag-0.5Bi- 8In solder was then ...the Sn-3.5Ag-0.5Bi-8In solder under the same conditions is shown in ...of solder, indium was dispersed over the entire ...

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Improvement of Joint Reliability of Sn Ag Cu Solder Bumps on Cu by a Laser Process

Improvement of Joint Reliability of Sn Ag Cu Solder Bumps on Cu by a Laser Process

... and solder balls were ultrasonically rinsed in an ethanol ...the solder balls had been dipped in the flux, they were placed on the Cu ...The solder balls were heated in air using a laser soldering ...

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Effect of Ni or Co Addition to Sn Ag Solder on Microstructure and Joint Strength at Interface

Effect of Ni or Co Addition to Sn Ag Solder on Microstructure and Joint Strength at Interface

... alloys, Sn-Ag(-Cu) system solders are considered the most promising lead-free solders for both wave and reflow soldering ...of solder and interfacial reactions have been ...the Sn-Ag ...

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Effect of Cu Addition to Sn Ag Lead Free Solder on Interfacial Stability with Fe 42Ni

Effect of Cu Addition to Sn Ag Lead Free Solder on Interfacial Stability with Fe 42Ni

... like to leave the identification of the Cu-Ni-Sn compound as a subsequent work because some unexpected factors such as electron shower beam can influence the EDS quantitative analysis. For the further work, a ...

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Effect of Corrosion on Mechanical Reliability of Sn Ag Flip Chip Solder Joint

Effect of Corrosion on Mechanical Reliability of Sn Ag Flip Chip Solder Joint

... Another interesting feature to note from this study is that the corrosion location will impact the required shear strength. The top-side corroded bump did not significantly affect the shear strength of the ...

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Influence of Noble Metal Coating on Wettability of Copper Substrate by Sn Ag Eutectic Solder

Influence of Noble Metal Coating on Wettability of Copper Substrate by Sn Ag Eutectic Solder

... water and then air dried. In addition, the wettabilities of pure Au (99.99%), Ag (99.99%) and Pd (99.95%) substrates, having a size of 10 30 0:3 mm 3 , were also investigated for the comparison with those of the ...

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Impact Properties of Lead Free Sn Ag Cu Ni Ge Solder Joint with Cu Electrode

Impact Properties of Lead Free Sn Ag Cu Ni Ge Solder Joint with Cu Electrode

... of solder composition on ball shear strength was slight when the aging time was 1000 ...lead-free solder joints investigated. On the contrary, it was found that the Sn-Ag- Cu-Ni-Ge joints ...

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The Microstructure, Thermal Fatigue, and Failure Analysis of Near Ternary Eutectic Sn Ag Cu Solder Joints

The Microstructure, Thermal Fatigue, and Failure Analysis of Near Ternary Eutectic Sn Ag Cu Solder Joints

... eutectic Sn-Ag-Cu ...eutectic Sn-Ag-Cu alloys has been reported in terms of the formation of large Ag 3 Sn plates and their effects on mechanical properties of Pb-free ...

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Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn Ag Cu Solder Joint

Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn Ag Cu Solder Joint

... formed at all of the interfaces of the ENIG and ENEPIG boards and that the thickness increased with increasing thermal aging time. Moreover, it was found that the IMC formed on the ENEPIG board grew more slowly in ...

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Pb Free Sn Ag Cu Mn Solder

Pb Free Sn Ag Cu Mn Solder

... A solder alloy comprises Sn, Ag, Cu, and Mn and has a melting temperature of about 211 degrees ...A solder joint and solder process embody the solder alloy as well as ...

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Acoustic Microscopy of Interfacial Crack in Sn Ag Cu Alloy Solder Joints under Shear Fatigue Testing

Acoustic Microscopy of Interfacial Crack in Sn Ag Cu Alloy Solder Joints under Shear Fatigue Testing

... lead, solder materials for electronic products have been replaced from Pb-Sn alloys to lead-free ...the solder joints, and finally to result in ...lead-free solder 1–13) and ...

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Sn Ag Based Solders Bonded to Ni P/Au Plating: Effects of Interfacial Structure on Joint Strength

Sn Ag Based Solders Bonded to Ni P/Au Plating: Effects of Interfacial Structure on Joint Strength

... eutectic Sn-Pb solder, which is commonly used, is environ- mentally harmful and can potentially affect human ...eutectic Sn-Pb solder are the Sn-Ag based ...eutectic Sn-Pb ...

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Melting and Joining Behavior of Sn/Ag
and Sn Ag/Sn Bi Plating on Cu Core Ball

Melting and Joining Behavior of Sn/Ag and Sn Ag/Sn Bi Plating on Cu Core Ball

... Cu-core solder balls exhibited shear strength comparable to those using previously alloyed solder ever, fractures began to occur at the joint interface for SB-SA joints due to thermal ...the ...

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Study on Sn  Ag Oxidation and Feasibility of Room Temperature Bonding of Sn  Ag  Cu Solder

Study on Sn Ag Oxidation and Feasibility of Room Temperature Bonding of Sn Ag Cu Solder

... metallic Sn and one for Sn oxides. Bonding energies of Sn 3d5/2 metal and oxide peak are located approximately at ...of Sn oxide to Sn metal in XPS spectra indicates that Sn ...

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Recovery of Sn, Ag and Cu from Waste Pb Free Solder Using Nitric Acid Leaching

Recovery of Sn, Ag and Cu from Waste Pb Free Solder Using Nitric Acid Leaching

... to reach thermal equilibrium (30­90°C). A 2 g sample of the solder powder with a particle size of less than 125 µm was then added to the reactor in all the experiments, except for the pulp density test. The ...

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Interfacial Reaction between Sn  Ag  Co Solder and Metals

Interfacial Reaction between Sn Ag Co Solder and Metals

... between SnAg–Cu solder and plated iron to revel the effect of iron-plating conditions on reactions in molten ...lead-free solder was largely attributable to the grain size of the plated ...

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Fluxless Sn 3 5 mass%Ag Solder Bump Flip Chip Bonding by Ultrasonic Wave

Fluxless Sn 3 5 mass%Ag Solder Bump Flip Chip Bonding by Ultrasonic Wave

... to solder bump flip chip bonding as a fluxless bonding ...eutectic Sn–Pb solder (183 ◦ ...eutectic Sn–Pb ...to solder flip chip devices sensitive to high operation temperature because ...

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Influence of Shear Height on Shear Strength of Tin Lead Solder Ball Bonding

Influence of Shear Height on Shear Strength of Tin Lead Solder Ball Bonding

... eutectic Sn–37 mass%Pb ball bonding and Sn–36 mass%Pb–2 mass%Ag one have been carried out un- der the condition of two kinds of the shear height (Z = 0 µm and Z = 200 ...

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Effect of Surface Finishes on Ball Shear Strength in BGA Joints with
Sn 3 5 mass%Ag Solder

Effect of Surface Finishes on Ball Shear Strength in BGA Joints with Sn 3 5 mass%Ag Solder

... the BGAs usually have the Au/Ni surface finish. Each layer of the metal plated on BGA substrates has its own specific functions. Nickel layer is used as a barrier to prevent copper from diffusing into solder balls ...

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Effect of Zn Addition on Interfacial Reactions Between Sn Bi Solder and Cu Substrate

Effect of Zn Addition on Interfacial Reactions Between Sn Bi Solder and Cu Substrate

... eutectic Sn-58Bi solder used in this study was a com- mercially available Sn-Bi solder ...The Sn-Bi-Zn solder alloy was prepared in-house by dissolving a Zn wire ...molten ...

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