Sn-Ag-In solder
Properties of Solder Joints Using Sn Ag Bi In Solder
8
Improvement of Joint Reliability of Sn Ag Cu Solder Bumps on Cu by a Laser Process
5
Effect of Ni or Co Addition to Sn Ag Solder on Microstructure and Joint Strength at Interface
6
Effect of Cu Addition to Sn Ag Lead Free Solder on Interfacial Stability with Fe 42Ni
7
Effect of Corrosion on Mechanical Reliability of Sn Ag Flip Chip Solder Joint
6
Influence of Noble Metal Coating on Wettability of Copper Substrate by Sn Ag Eutectic Solder
7
Impact Properties of Lead Free Sn Ag Cu Ni Ge Solder Joint with Cu Electrode
5
The Microstructure, Thermal Fatigue, and Failure Analysis of Near Ternary Eutectic Sn Ag Cu Solder Joints
8
Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn Ag Cu Solder Joint
7
Pb Free Sn Ag Cu Mn Solder
15
Acoustic Microscopy of Interfacial Crack in Sn Ag Cu Alloy Solder Joints under Shear Fatigue Testing
8
Sn Ag Based Solders Bonded to Ni P/Au Plating: Effects of Interfacial Structure on Joint Strength
9
Melting and Joining Behavior of Sn/Ag and Sn Ag/Sn Bi Plating on Cu Core Ball
7
Study on Sn Ag Oxidation and Feasibility of Room Temperature Bonding of Sn Ag Cu Solder
6
Recovery of Sn, Ag and Cu from Waste Pb Free Solder Using Nitric Acid Leaching
6
Interfacial Reaction between Sn Ag Co Solder and Metals
6
Fluxless Sn 3 5 mass%Ag Solder Bump Flip Chip Bonding by Ultrasonic Wave
5
Influence of Shear Height on Shear Strength of Tin Lead Solder Ball Bonding
7
Effect of Surface Finishes on Ball Shear Strength in BGA Joints with Sn 3 5 mass%Ag Solder
6
Effect of Zn Addition on Interfacial Reactions Between Sn Bi Solder and Cu Substrate
5