void formation
Effect of Annealing Atmosphere on Void Formation in Copper Interconnects
... which have been observed in Al-alloy interconnects were concluded that these EM and SM caused void formation (or growth). EM is a phenomenon which involves atomic fluxes induced by electric current in ...
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Void Formation and Structure Change Induced by Heavy Ion Irradiation in GaSb and InSb
... the formation of anti phase ...the void formation and structure change between GaSb and InSb are caused by the difference in the behaviors of point ...
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Effect of Zinc Addition on Void Formation in Solid Liquid Interdiffusion Bonding of Copper
... of void formation in the Cu/Sn system is basically caused by unbalanced diffusion fluxes (Cu flux > Sn flux ) in the Cu 3 Sn phase, that is to say, the ...
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Stokes–Brinkman formulation for prediction of void formation in dual scale fibrous reinforcements: a BEM/DR BEM simulation
... the void formation using the Stokes–Brinkman and Stokes–Darcy formulations are com- pared each other, which has not been reported before to the best of our ...
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Molecular Dynamics Simulation of Void Generation during Annealing of Copper Wiring
... the void formation was because the movement of Cu atoms was much easier ...on void generation is not strong as that of adhesion ...the void formation was because the movement of Cu ...
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Failure mechanisms in DP600 steel: Initiation, evolution and fracture
... A similar behaviour has been identified for the damage initiation at the vicinity of the ferrite grain boundaries. Fig. 6a shows that damage starts by micro-void formation at the triple junction of the ...
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Effect of Surface Treatment and Crystal Orientation on Microstructural Changes in Aluminized Ni Based Single Crystal Superalloy
... phases, is larger than that of a bcc structured aluminized coating layer. 12) Therefore, during the cooling process after aluminizing, this difference in thermal expansion coefficient caused tensile stress between the ...
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Effect of Organic Additives on Formation and Growth Behavior of Micro Void in Electroplating Copper Films
... As shown in Fig. 2, the void formation in the electroplated Cu films was induced by the existence of the organic additives in the plating bath. The experimental results suggested that the micro-voids formed ...
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Copper and Nickel Alloys Clad with Platinum and Its Alloys64-71
... of platinum-5 per cent cobalt to copper or copper-tin alloys by welding are due to ex- cessive void formation in the diffusion layer, resulting from the Kirkendall e[r] ...
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Void Generation Mechanism in Cu Filling Process by Electroplating for Ultra Fine Wire Trenches
... lm formation process as a function of time and found that the fl ow of Cu electrolyte solution is not homogeneous in the trench, resulting in void formation at one side of the trench wall during ...
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Molecular Dynamics Investigation on Microstructure and Void in Amorphous SiO2
... a void sphere was inserted in contact with these four atomic ...inserted void were to overlap with any atom, it would be removed from the ...another void or several nearest voids, as shown in ...th ...
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Potential of voids to enhance natural ventilation in medium cost multi storey housing (MCMSH) for hot and humid climate
... ‘Void’ means air well / atria, which is normally in the centres of a building [27]. An air well is a passive architectural feature which is adopted for natural lighting and ventilation [9, 13, 28]. According to ...
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Aspect and XML-oriented Semantic Framework Generator:SmartTools
... public void before(AffectNode node, Object param) {unplugVariableCheck = true;} public void visit1(AffectNode node, Object param) {unplugVariableCheck = false;} public void after(AffectN[r] ...
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Comparing Design Void Content with Actual Void Content of Laboratory Prepared Pervious Concrete
... actual void content that is much closer to the design void ...actual void content difference for all limestone mixtures was on average only ...design void content the closer the average actual ...
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Formation of Nano Void and Characteristics of Nano Particles in Material Physics Review
... of void: For the most part, opening of void debilitates the ability of bearing the ...in formation of void by comparing with the deformation of semi crystalline sample (Pawlak and Galeski, ...
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Parallel text compression : source
... eventnode *newnode void rebuild_tree ; void arithmetic_encode ; void doneencoding ; void startoutputingbits ; void startencoding ; void write_method ; void doneoutputingbits ; void[r] ...
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Voidable and void construction contracts
... The contract is normally a massive and complex document. 1 The word ‘contract’ in a legal sense refers to an agreement between two or more parties that is legally binding between them: in the words of section 2(h) of the ...
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Interface Reaction and Mechanical Properties of Lead free Sn Zn Alloy/Cu Joints
... reliability of solder joints formed with Sn–Zn alloys. More- over, Cu–Zn compounds form at the interfaces of Sn–Zn al- loys and Cu. 3) This is different from the case of most other lead-free solders, which show Cu–Sn ...
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Deirdre McLoughlin : Shaping the Void
... Solo Exhibitions 2008 Peppercanister Gallery, Dublin 2005 Frank Steyaert Gallery, Ghent 2004 DUET10, Deirdre McLoughlin - Wicher Meursing, SBK, Amsterdam 2003 Peppercanister Gallery, Dub[r] ...
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THEORY OF ELECTRON-DIFFRACTION BY VOID LATTICE
... that the observed positions and intensities agree with the predictions, and that the clus- tering of the observed void-lattice spots around the host spots is to be expected Secondly, [r] ...
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