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inter-chip and intra-chip Harm Dorren and Oded Raz

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(1)

Will photonics penetrate into

Will photonics penetrate into

inter-chip and intra-chip

communications?

communications?

(2)

On-chip interconnect networks

T RX RX RX RX R

TX X

TX TX TX TX RX Electronic on-chip interconnect network

• Interconnect needs repeaters

• Each repeater receive, buffers and re-transmits every bit • Higher clock frequencies: more power per repeater and

more repeaters T N t ki R Photo by IBM • No repeaters P i d d t f di t / t lk t TX RX

Optical on-chip interconnect network

Networking

• Power independent of distance/ no cross talk, etc

Forecast for 2020

• 10 TFLOP processors

On chip I/O 1 byte per flop (Amdahl)

/Department of Electrical Engineering 24-10-2009 PAGE 2

• On-chip I/O ~ 1 byte per flop (Amdahl)

• Power electronic network 10 TFLOPs chip ~ 500 Watts • ~ 7 pJ/bit or 7 mW/Gb/s

(3)

Photonic interconnect network:

Receiver

Receiver

Receiver Transmission path Transmitter Processor plane Interconnect plane

Typical receiver sensitivity at BER 10-9

PIN APD Power (TIA)

40 Gb/ 10 dB 250 W 40 Gb/s -10 dBm - ~ 250 mW 10 Gb/s -20 dBm - 25 dBm ~200 mW 2.5 Gb/s -25 dBm -30 dBm ~75 mW PAGE 3 24-10-2009

(4)

Photonic interconnect network

Transmission path

Transmission path

Receiver Transmission path Transmitter

Typical waveguide losses

Typical losses Bending radius

Silica 0 01 dB/cm 500 micrometer Silica 0.01 dB/cm 500 micrometer Etchless silicon 0.3 dB/cm 50 micrometer

SOI 2.4 dB/cm 5 micrometer

PAGE 4 24-10-2009

/Department of Electrical Engineering

(5)

Photonic Interconnect network:

Option 1: Off-chip laser and transmitter

Option 1: Off chip laser and transmitter

Receiver Transmission path Receiver Laser Modulator Coupling losses (3dB) losses (3dB)

Power laser Power

modulator Power modulator driver Insertion losses 40 Gb/s 150 mW 60 mW 5 85 W 8 dB 40 Gb/s 150 mW 60 mW 5.85 W 8 dB 10 Gb/s 150 mW < 50 mW 3.6 W 8 dB 2.5 Gb/s 150 mW < 50 mW 1~2 W 8 dB 24-10-2009 PAGE 5

/Department of Electrical Engineering

Silicon modulators, MZI or Ring resonator, limited data available, but high losses, and high power!

(6)

Direct modulation

Use microdisk laser (diameter 7.5 micrometer)

Threshold current is ~ 0.1 mA Power 5 mW (2V, 2.5mAmps)

Optical power in waveguide ~ 50 mW

10 Gb/s wavelength conversion is possible but

24-10-2009 PAGE 6

/Department of Electrical Engineering

direct modulation at high speed never been demonstrated

(7)

Link and power budget

40 Gb/s (off-chip laser)

40 Gb/s (off chip laser)

R i iti it (PIN) 10 db

Receiver sensitivity (PIN): -10 dbm Waveguide losses: 5 dB Insertion losses modulator: 8 dB Coupling lossesp g 3 dB

Required laser power 6 dbm (4mW)

Power laser 150 mW

Power laser 150 mW

Power modulator 60 mW

210 mW (5.25 mW/Gb/s)

Power modulator driver 5850 mW

Power TIA Receiver: 250 mW

6100 mW (153 mW/Gb/s)

24-10-2009 PAGE 7

(8)

Link and power budget

10 Gb/s (off-chip laser)

10 Gb/s (off chip laser)

R i iti it (APD) 25 dB

Receiver sensitivity (APD): - 25 dBm Waveguide losses: 5 dB Insertion losses modulator: 8 dB Coupling lossesp g 3 dB

Required laser power -9 dbm (0.13 mW)

Power laser 150 mW

Power modulator 50 mW

200 mW (20 mW/Gb/s)

Power modulator driver 3600 mW

Power TIA Receiver: 200 mW

3800 mW (380 mW/Gb/s)

24-10-2009 PAGE 8

(9)

Link and power budget

2 5

Gb/s (off-chip laser)

2.5

Gb/s (off-chip laser)

R i iti it (APD) 30 dB

Receiver sensitivity (APD): - 30 dBm Waveguide losses: 5 dB Insertion losses modulator: 8 dB Coupling lossesp g 3 dB

Required laser power -14 dbm (0.04 mW)

Power laser 150 mW

Power modulator 50 mW

200 mW (80 mW/Gb/s)

Power modulator driver 1000 mW

Power TIA Receiver: 75 mW

1075 mW (430 mW/Gb/s)

24-10-2009 PAGE 9

(10)

Link and power budget

2 5 Gb/s (direct modulation)

2.5 Gb/s (direct modulation)

R i iti it (APD) 30 db

Receiver sensitivity (APD): - 30 dbm Waveguide losses: 5 dB Insertion losses modulator: 8 dB Coupling lossesp g 3 dB

Required laser power -14 dbm (0.04 mW)

Power laser 5 mW

Power modulator 0 mW

5 mW (2 mW/Gb/s)

Power modulator driver 0 mW

Power TIA Receiver: 75 mW

75 mW (30 mW/Gb/s)

24-10-2009 PAGE 10

(11)

Bandwidth distance product

including driver power

10000

including driver power

1000 10000 W ) Off-chip laser at 2.5, 10 and 40 Gb/s 10 100 ow e r ( m W Electronic with Direct modulation at 2.5 Gb/s 0 1 1

P repeaters (3.5 GHz)Electronic with

0.1

0 5 10 15 20 25

Distance (mm)

(12)

Bandwidth distance product

without driver power

1000

without driver power

100 m W) Electronic with t (3 5 GH ) Off-chip laser at 2.5 10 and 40 Gb/s 1 10 Po w e r ( m repeaters (3.5 GHz) Direct modulation at 2 5 Gb/s 0.1 1 at 2.5 Gb/s 0 5 10 15 20 25 distance (mm)

(13)

Conclusions (1)

Off-chip laser

- Sufficient link budget to allow some networking,

but, ….. high power dominated by drivers

On-chip laser

S ffi i

t

f

i

l li k b t

- Sufficient power for a single link, but, ….

insufficient link budget for a network on a chip

(14)

Conclusions (2)

Photonics gives an improved bandwidth distance

g

product:

B

d idth i li it d b

l

t

i

th

h t

i

Bandwidth is limited by electronics, thus photonics

only gives distance!!!

Need applications with “distance”

24-10-2009 PAGE 14

References

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