Sn-Cu
Sn-Cu Alloy Materials with Optimized Nanoporous Structure and Enhanced Performance for Lithium-Ion Batteries Prepared by Dealloying
... six Cu-Sn alloys are 591 mA h g -1 (A1), 807 mA h g -1 (A2), 479 mA h g -1 (B1), 550 mA h g -1 (B2), 534 mA h g -1 (C1) and 596 mA h g -1 ...nanoporous Sn-Cu alloys, their specific capacities ...
10
Fluxless Bonding of Ni P/Cu Plated Al Alloy and Cu Alloy with Lead Free Sn Cu Foil
... the Sn- Cu solder joint is estimated to be 13 MPa from shear strength of the Sn-Ag solder joint 6) and the ratio of the tensile strength of the Sn-Cu and the Sn-Ag ...the ...
6
The Effects of Microstructure and Ag3Sn and Cu6Sn5 Intermetallics on the Electrochemical Behavior of Sn-Ag and Sn-Cu Solder Alloys
... the Sn-Cu and Sn-Ag alloys can be considered as promising solder alternatives, few studies highlighting the effects of the morphologies and scales of the phases constituting their microstructures on ...
17
Calorimetric Investigations of Liquid Cu In Sn Alloys
... Lead-tin base solders have long been the most popular materials for electronic packaging because of their low cost and superior properties required for interconnecting elec- tronic components. However, the toxic nature ...
8
Experimental Observation on Solid State Reactive Diffusion between Sn Ag Alloys and Ni
... the Sn–Cu and Ni specimens in the diffusion couple during ...of Cu into Sn accelerates the inter- metallic growth within the experimental annealing ...the Cu addition foments the ...
6
Effect of Crystal Orientation on Sn Whisker Free Sn Ag Cu Plating
... The present analysis reveals that mechanically induced whiskers grow rapidly on non-re fl owed Sn Cu plating, whiskers and nodules form on re fl owed Sn Cu plating, and nodules form on ...
7
Electro-catalytic Reduction of Aqueous Nitrates using Cu-Sn and Cu-Pd Cathodes
... Pd, Cu, Sn, Cu-Sn, and Pd-Cu did show catalytic ...and Cu only reduces nitrate under the specified reaction ...of Cu with Pd or Cu with Sn are effective as ...
17
Electrodeposition of Tin Based Film on Copper Plate for Electrocatalytic Reduction of Carbon Dioxide to Formate
... the Cu substrate after ...the Sn based film on the Sn/Cu electrode, which shows that the Sn based film is tightly adhered to the Cu ...the Sn/Cu electrode. It can ...
9
Joints Soldered on Electroless Ni Au Surfaces Using Cu Containing Flux: Strength, Microstructure and Mechanism of Improvement
... for Sn–4.0Ag–0.5Cu solder ball joints; however, in the case of Sn–37Pb ball joints, each flux yielded different intermetallic ...interfacial Sn–Cu–Ni compounds rich in Cu but with ...
6
Metallurgy and Kinetics of Liquid Solid Interfacial Reaction during Lead Free Soldering
... solders, Sn–Ag eutectic (96.5%Sn–3.5%Ag), Sn–Cu eutectic ...and Sn–Ag–Cu eutectic ...immersion Sn, and Ni/Au, in addition to mechanically polished pure copper ...
9
Effect of In Addition on Wetting Properties of Sn Zn In/Cu Soldering
... With rapid advances in technology around the world, development of the electronic industry has become an important indicator of a country’s competitiveness. In Taiwan, traditional labor-intensive industries have ...
6
Reactions in Electrodeposited Cu/Sn and Cu/Ni/Sn Nanoscale Multilayers for Interconnects
... into Cu-Sn based intermetallic compounds (IMCs) after ...to Cu-Sn-based ...of Cu/Sn/Cu/Sn/Cu or ...
14
Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating
... of Cu wire/Sn bonding and Cu wire/CuSn intermetallic compound bonding are shown in ...the Sn/CuSn intermetallic compound interface and the Cu Sn intermetallic compound / ...
6
Physico-mechanical and Tribological Properties of Fe-Cu-Ni-Sn and Fe-Cu-Ni-Sn-VN Nanocomposites Obtained by Powder Metallurgy Methods
... The results of studies aimed at improving the mechanical and operational properties of the Fe Cu Ni Sn and Fe Cu Ni Sn VN composite materials obtained by powder metallurgy ...
11
Study on Sn Ag Oxidation and Feasibility of Room Temperature Bonding of Sn Ag Cu Solder
... In recent years, development of environmental friendly materials has been greatly concerned. 1,2) The increasing demands of high density, high operating speed and high performance in electronic devices are driving ...
6
Improvement of Joint Reliability of Sn Ag Cu Solder Bumps on Cu by a Laser Process
... the Sn-Ag-Cu solder and Cu pads after laser soldering and ...the Cu pad and the first layer, and the total thickness of the IMC layer ...
5
Effects of Microstructure of Deposited Sn Films and Orientation Index of Cu Foils on Sn Whisker Formation Using Substitutionally Deposited Sn Films
... of Cu foils, used as a copper pattern for flexible printed circuits (FPC), and the grain size of substitutionally-deposited crystalline Sn films on Sn whisker formation were ...
8
Effect of Trace Cu on Microstructure, Spreadability and Oxidation Resistance Property of Sn xCu Solders
... trace Cu on the microstructure, the spreadability and the oxidation resistance property of Sn-xCu lead-free ...the Cu content had a significant impact on the microstructure, the microstructure of ...
5
Study of size mismatches effect on transport properties in Cu-Sb and Cu-Sn liquid alloys
... A perusal of the plots in Figs.3 and 4 for the two alloys shoes that the plots NSE are symmetrical about equi-atomic composition while there is significant asymmetry in WSE plots due to size mismatch. In addition, we ...
8
A Molecular Dynamics Investigation of the Effect of Pressure and Orientation on the Cu Consumption in Cu-Cu3Sn Interface under Isothermal Ageing and Its Dissipative Mechanisms during Traction
... the Cu part gradually, thereby the lower yield stress of Cu induces the decrease of stress during traction in figure 9 ...of Cu influences the fraction location in Cu-Cu 3 Sn ...
15