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Sn/Pb solder joint

Transmission Electron Microscopy of Interfaces in Joints between Pb Free Solders and Electroless Ni P*

Transmission Electron Microscopy of Interfaces in Joints between Pb Free Solders and Electroless Ni P*

... Recently Pb free solders have attracted much attention as substitutes for the conventional PbSn eutectic solders in order to cope with environmental ...a solder joint ...of ...

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Pb Free Sn Ag Cu Mn Solder

Pb-Free Sn-Ag-Cu-Mn Solder

... A solder alloy comprises Sn, Ag, Cu, and Mn and has a melting temperature of about 211 degrees ...A solder joint and solder process embody the solder alloy as well as ...

15

Joining of Copper Plates by Unusual Wetting with Liquid Tin and Tin Lead Solder on “Surface Fine Crevice Structure”

Joining of Copper Plates by Unusual Wetting with Liquid Tin and Tin Lead Solder on “Surface Fine Crevice Structure”

... the joint experiment. A 10 × 12 mm area on the 15 × 15 mm plate and the entire area on the 10 × 10 mm plate were irradi- ated by laser under the same conditions as the wetting exper- iments. As shown in Fig. 6, ...

5

Shear Strength Degradation of Pb Free Solder Joint with Mounted Location in Automobile

Shear Strength Degradation of Pb Free Solder Joint with Mounted Location in Automobile

... 3.0Ag-0.5Cu under thermal cycling of the engine room environment were degraded by up to 40% and 25% higher than that of cabin room conditions, respectively. In the case of cabin electronics, larger chip components ...

5

Properties of Solder Joints Using Sn Ag Bi In Solder

Properties of Solder Joints Using Sn Ag Bi In Solder

... and Pb in the joint interface forms a low melting-point compound ...the joint interface is already in a melted condition, board warp easily causes the interface to ...are Sn-Pb- plated ...

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Improvement of Joint Reliability of Sn Ag Cu Solder Bumps on Cu by a Laser Process

Improvement of Joint Reliability of Sn Ag Cu Solder Bumps on Cu by a Laser Process

... Currently, Sn-Ag-Cu solders such as ...industry. Sn-Ag-Cu solders are generally harder and less ductile than lead-containing solders like ...of Sn-Ag-Cu solders is their high reaction rate with ...

5

Sn Ag Based Solders Bonded to Ni P/Au Plating: Effects of Interfacial Structure on Joint Strength

Sn Ag Based Solders Bonded to Ni P/Au Plating: Effects of Interfacial Structure on Joint Strength

... eutectic Sn-Pb solder, which is commonly used, is environ- mentally harmful and can potentially affect human ...eutectic Sn-Pb solder are the Sn-Ag based ...eutectic ...

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Temperature Effect on Tensile Behaviour of Sn Pb Eutectic Solder

Temperature Effect on Tensile Behaviour of Sn Pb Eutectic Solder

... though solder materials are evolving to be lead-free as legislated by RoHS [1,2], tin/lead (Sn-Pb) eutectic solder materials are still widely applied in the defense and aerospace industries ...

5

Pb Free Sn Ag Cu Mn Solder

Pb Free Sn Ag Cu Mn Solder

... A solder alloy comprises Sn, Ag, Cu, and Mn and has a melting temperature of about 211 degrees ...A solder joint and solder process embody the solder alloy as well as ...

15

BGA Jointing Property of Sn 8 8 mass%Zn and Sn 8 0 mass%Zn 3 0 mass%Bi Solder on Electroless Nickel Phosphorus/Immersion Gold Plated Substrates*

BGA Jointing Property of Sn 8 8 mass%Zn and Sn 8 0 mass%Zn 3 0 mass%Bi Solder on Electroless Nickel Phosphorus/Immersion Gold Plated Substrates*

... (Pb)-free solder has been desired as replacement for the conventional SnPb solder because Pb induces environmental ...of Pb-free solder have already designed for ...

7

Recovery of Sn, Ag and Cu from Waste Pb Free Solder Using Nitric Acid Leaching

Recovery of Sn, Ag and Cu from Waste Pb Free Solder Using Nitric Acid Leaching

... waste Pb-free cream solder, wherein the solder is melted at 220­ 230°C followed by the separation of the organic flux and metal components by specific gravity ...

6

Acoustic Microscopy of Interfacial Crack in Sn Ag Cu Alloy Solder Joints under Shear Fatigue Testing

Acoustic Microscopy of Interfacial Crack in Sn Ag Cu Alloy Solder Joints under Shear Fatigue Testing

... lead-free solder alloys and the constants A and m were measured for the mode I crack propagation, no reports on the mode II crack ...lead-free solder alloy 8) was used in the present ...

8

Interfacial Reaction and Mechanical Characterization of Eutectic Sn  Zn/ENIG Solder Joints during Reflow and Aging

Interfacial Reaction and Mechanical Characterization of Eutectic Sn Zn/ENIG Solder Joints during Reflow and Aging

... the Sn–9Zn/ENIG interfaces reflowed at 503 K for different reaction ...the solder after reflow consisted of a -Sn matrix (gray phase) and fine rod-shaped Zn precipitates (black phase), with no Cu–Zn or ...

8

Fatigue Reliability Evaluation for Sn  Zn  Bi and Sn  Zn Lead Free Solder Joints

Fatigue Reliability Evaluation for Sn Zn Bi and Sn Zn Lead Free Solder Joints

... of Pb as solder material has been ...of Pb and whether Pb should be removed from solder ...of Pb, especially in European countries and ...replacing SnPb eutectic ...

6

Shear Strength and Interfacial Compound of Sn Ag Bi In Alloy

Shear Strength and Interfacial Compound of Sn Ag Bi In Alloy

... the solder balls, Sn37Pb and Sn3Ag8Bi5In, are given in ...the solder ball is affected by the thickness of the intermetallic compound, and the overgrown intermetallic compound is detrimental to joint ...

6

Effect of Corrosion on Mechanical Reliability of Sn Ag Flip Chip Solder Joint

Effect of Corrosion on Mechanical Reliability of Sn Ag Flip Chip Solder Joint

... Another interesting feature to note from this study is that the corrosion location will impact the required shear strength. The top-side corroded bump did not significantly affect the shear strength of the Sn-Ag ...

6

Interfacial Reaction between Sn  Ag  Co Solder and Metals

Interfacial Reaction between Sn Ag Co Solder and Metals

... the solder and plated iron to examine the dissolution of plated iron into ...acetone. Solder wire ...the solder and plated iron and to measure the dissolution thickness of plated ...between ...

6

Effect of Ni or Co Addition to Sn Ag Solder on Microstructure and Joint Strength at Interface

Effect of Ni or Co Addition to Sn Ag Solder on Microstructure and Joint Strength at Interface

... alloys, Sn-Ag(-Cu) system solders are considered the most promising lead-free solders for both wave and reflow soldering ...of solder and interfacial reactions have been ...the Sn-Ag solder on ...

6

Anomalous Creep in Sn Rich Solder Joints

Anomalous Creep in Sn Rich Solder Joints

... A primary cause of service failures in solder joints is ther- mal fatigue. When an electronic device is turned on or off, or its internal circuits are activated, the soldered joints are heated or cooled. The ...

7

Improved reliability of planar power interconnect with ceramic based structure

Improved reliability of planar power interconnect with ceramic based structure

... the solder joints in the flexible PCB and ceramic-based interconnect ...in solder joints [19] and was therefore not ...eutectic Sn-3.5Ag solder alloy has a melting point of 221 ºC, and the ...

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