[PDF] Top 20 Microstructure and Shear Strength of Low Silver SAC/Cu Solder Joints during Aging

... the aging temperature is, the faster the IMC thick- ness grows. As the aging time increased, the thickness of in- terfacial IMC increases as the parabolic growth trend, and the growth speed of the ... See full document

... the solder and lower frequency of crack formation in the IMC layer, the as-reflow SA joint showed higher impact shear strength than the SAC ...With aging, the fraction of IMC fracture ... See full document

... of solder ball shear strength was found to be mainly caused by the formation of intermetal- lic compound layers, together with the microstructure coars- ...ening. During the ... See full document

... of low cost and easy application without under bump metallurgy ...Au-Sn solder, 3) but considered the efficient transmission of optical signal, flip-chip using thermo-compression bonding process is limited ... See full document

... and solder joint strength was studied for the solder joints on Cu/Ni/Ag ...the solder joint with different soldering temperature profiles 1 and 2 of ...the solder ball ... See full document

... joining, solder balls were dipped into rosin flux and then planted on the pads ...The solder balls were re- flowed by using a hot air ...the solder balls to melt was 90 s. After reflowing the ... See full document

... the Cu in solder balls was mostly removed during the formation of the η ...ball shear test, cold bump pull and hot bump pull tests, mechanical properties of the obtained BGA joints were ... See full document

... on low melting point, high concentration bismuth in tin-based solder alloys like Sn-58wt%Bi, Sn-57wt%Bi-1wt%Ag and ...SnBi solder paste is in the market already but one drawback of not using in ... See full document

... severe aging resulted in a flat-fracture surface and solder alloy was not present on the fracture ...ball shear test, fracture occurs at the interface or in the region with the lowest ...the ... See full document

... of solder joint sam- ples made from the baseline ...Sn–3.6Ag–1.0Cu–0.45Co. Solder joint microstructure and shear strength were examined using a model joint sample configuration, a ... See full document

... bulk solder and in the intermetallic ...of shear strength with the time and temperature, and various types of BGA pad surface fin- ishes (bare Cu, electroless Ni–P/Cu and immersion ... See full document

... case of Sn–Pb and Sn–Ag solders. As shown in Fig. 1, Au did not dissolve into the solder. Instead, due to the fast reaction of Au and Zn, an Au–Zn phase formed at the interface. Because Au and Zn were detected in ... See full document

... SAC405 solder alloy, the IMC’s formed on EN(P)EPIG exhibited much slower growth rates compared to IMC’s formed on electroless EN(B)EPIG during aging at ... See full document

... The solder material used for soldering need to have acceptable properties of wettability, thermal behaviour, mechanical properties such as tensile strength and low ...main solder material for ... See full document

... of Cu during reflow at 483 K was about ...of Cu consumed in Sn–Pb after 1 min reflow was about ...of Cu with Pb- free solder is much faster than with Sn–Pb solder because of the ... See full document

... The electronic industry is making substantial progress toward a full transition to Pb-free soldering in the near future. At present, the leading candidate Pb-free solders are near-ternary eutectic Sn-Ag-Cu alloys. ... See full document

... Sn-58Bi solder used in this study was a com- mercially available Sn-Bi solder ...Sn-Bi-Zn solder alloy was prepared in-house by dissolving a Zn wire ...molten solder was stirred me- chanically ... See full document

... of solder joints which are related to the change in solder ...Therefore, solder volume has to be a known value. If the solder bump is made by electroplating, solder volume can ... See full document

... an aging treatment. The aging treatment was carried out at 398 K for ...and aging treatment, microstructural observation of the solder joint was carried ...The microstructure of the ... See full document

... Poor solder joints (loose solder balls, solder bridges, or cold solder joints).. NOTE2[r] ... See full document