Cu/Ni/Au solder joint
Interfacial Reactions in Sn 57Bi 1Ag Solder Joints with Cu and Au Metallization
... the solder joint is higher, the reliability of the solder joint degrades if the solder joint has several voids, as shown in ...the solder joint without the ...
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Influence of the Interfacial Reaction Layer on Reliability of CSP Joints Using Sn 8Zn 3Bi Solder and Ni/Au Plating
... Because Au and Zn were detected by EPMA quantitative analysis in this layer, this reaction product is thought to be IMC composed of Au and ...the joint subjected to higher reflow peak temperature ...
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Effect of Ni or Co Addition to Sn Ag Solder on Microstructure and Joint Strength at Interface
... mass%Ag solder was used as the basic solder and Sn-3.5 mass%Ag-0.1 mass%Ni, ...the solder added minor ...bare Cu and electroless Ni-8 mass%P (5 mm)/immersion Au over an ...
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Thermal cyclic test for Sn 4Ag 0 5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishes
... shows solder joints on Ni/Pd/Au surface finish after 200 and 1000 thermal cycles, which showed that no failure was detected in these ...of solder joint on Ni/Pd/Au finish ...
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Comparison of Lead Free Solder Joints Made by Immersion Gold Plating with Those Produced by Autocatalytic Electroless Gold Plating
... diameter Cu pads was prepared. On the surface of each pad, electroless Ni plating was ...conducted. Ni plating layer thickness was ...The Cu pads were produced by depositing Au on the ...
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Melting and Joining Behavior of Sn/Ag and Sn Ag/Sn Bi Plating on Cu Core Ball
... using Cu-core solder balls exhibited shear strength comparable to those using previously alloyed solder ever, fractures began to occur at the joint interface for SB-SA joints due to thermal ...
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Reliability of Solder Joint with Sn Ag Cu Ni Ge Lead Free Alloy under Heat Exposure Conditions
... the Ni/Au-plated Cu pad, the reaction layers do not uniformly form at the joint interfaces in all the ...the joint interfaces are relatively smaller than those of the joint using ...
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BGA Jointing Property of Sn 8 8 mass%Zn and Sn 8 0 mass%Zn 3 0 mass%Bi Solder on Electroless Nickel Phosphorus/Immersion Gold Plated Substrates*
... mounting. Solder ball of conven- tional Sn–Pb alloy has been used to connect BGA package on printed circuit board ...of solder as surface finishing for PCB of solder ball ...by Ni–P deposit, ...
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Microstructures Variations of Sn 9Zn 1Al and Sn 8Zn 3Bi Solder Pastes with Sn 3 8Ag 0 7Cu Solder Balls on OSP PCBs after Thermal Cycling Test
... the solder joint strengths must be understood before being applied to a manufacturing ...Pb-free solder pastes of Sn8Zn3Bi (SZB) and Sn9Zn1Al (SZA) have been used to assemble 0603 passive ...
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Shear Fracture Behavior on Ball Grid Arrayed Tin Silver Copper Solder/Pure Copper Pad Joint Interface
... Sn–Ag–Cu solder ball used in this ...Each solder/pure Cu (99.99%) pad joint is described as Ag contents in this ...pure Cu pad by mechanical ...pure Cu surface as ...
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Interfacial reaction between SAC305 and SAC405 lead free solders and electroless nickel/immersion silver (ENImAg) surface finish
... both Au layer and Pd layer does not improve solder joint reliability and wire ...the Au and Pd thickness to optimize the reliability of both wire bonding and ...and Cu-Ni-Sn ...
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Influence of Noble Metal Coating on Wettability of Copper Substrate by Sn Ag Eutectic Solder
... Pb-free solder is quite inferior to that of a Sn-Pb eutectic ...example, Au/Ni, Pd/Ni, Sn, Sn-Ag and Sn-Bi, on the electrode surface of a printed wiring board (PWB) and electronic device have ...
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Interfacial Reactions Between Sn 58 mass%Bi Eutectic Solder and (Cu, Electroless Ni P/Cu) Substrate
... metallcs. As shown in Fig. 5(a), the lower temperature data (70, 90 and 100 ◦ C) exhibited an apparent activation energy of 84.2 kJ/mol and the higher temperature data (100 and 120 ◦ C) had a value of 203.8 kJ/mol. ...
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Flip Chip Bump Formation of Sn 1 8Bi 0 8Cu 0 6In Solder by Stencil Printing
... The bump formation of a solder paste using the new solder alloy, 1.8Bi–0.8Cu–0.6In, the morphology of the IMCs, and the shear strength of the bumps were studied. Sn–37Pb, Sn– 3.5Ag and Sn–36Pb–2Ag were used ...
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Preparation and Characterization of Nano Size NiOOH by Direct Electrochemical Oxidation of Nickel Plate
... occurred during the oxidation process of Ni metal plate. During the electrooxidation process, it was observed that the reaction occurs very vigorously, however as the gas emitted from both anode and cathode were ...
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Effect of Au addition on Microstructural and Mechanical Properties of Sn Cu Eutectic Solder
... of Au addition on the microstructural and the tensile properties of ...With Au addition to Sn– Cu binary alloy, the eutectic endothermic peak in DSC, ...With Au beyond 2 mass%, the broad peak ...
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Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn 3 5Ag 0 75Cu Solder
... bulk solder and in the intermetallic ...(bare Cu, electroless Ni–P/Cu and immersion Au/Ni– P/Cu ...for Cu pad, electroless Ni–P/Cu pad and immersion ...
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Acoustic Microscopy of Interfacial Crack in Sn Ag Cu Alloy Solder Joints under Shear Fatigue Testing
... Copper plates of 1 mm in thickness were joined with a solder layer (60 mm in thickness) of Sn-3.8 mass% Ag-1.2 mass% Cu alloy, and then subjected to the shear fatigue testing. At required numbers of fatigue ...
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Microstructural Evolution of Joint Interface between Eutectic 80Au 20Sn Solder and UBM
... In the first experiment, we put the spherical specimens on a Ni substrate (with a purity higher than 99.9 percent and a thickness of 0.5 mm), after first polishing the substrate with 1 mm of diamond paste and ...
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IMC Growth of Solid State Reaction between Ni UBM and Sn 3Ag 0 5Cu and Sn 3 5Ag Solder Bump Using Ball Place Bumping Method during Aging
... to Ni consumption. Under the conditions in which the voids formed, Ni atom supply was limited due to diffusion through thick ...over Ni at the interface of IMC and ...and solder, not in the ...
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