high Pb-Sn solder
Influence of Shear Height on Shear Strength of Tin Lead Solder Ball Bonding
... were Sn–37 mass%Pb (de- scribed 37Pb later) and Sn–36 mass%Pb–2 mass%Ag (de- scribed 36Pb2Ag later) supplied by Nittetsu Micro Metal ...(Japan High Tech Co) was attached on the stage of ...
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Recovery of Sn, Ag and Cu from Waste Pb Free Solder Using Nitric Acid Leaching
... waste Pb-free cream solder, wherein the solder is melted at 220 230°C followed by the separation of the organic flux and metal components by specific gravity ...of high energy and the emission ...
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Thermodynamics Aided Alloy Design and Evaluation of Pb free Solders for High Temperature Applications
... the Sn–3.5Ag solder is used in the next level packaging, the required melting temperature for step soldering is between 255 to 320 ◦ ...10, Sn–5Sb and Sn–10Sb are not suitable for high ...
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Development of Sn Based, Low Melting Temperature Pb Free Solder Alloys
... variable and lnðtÞ and (1=T ) as the independent variables; the coefficients were lnðAÞ, n, and H=R. The kinetics param- eters A, n, and H are listed in Table 5, along with those of other high-Sn, ...
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Anomalous Creep in Sn Rich Solder Joints
... example Sn-rich solders that have become candidates for use in Pb-free solder ...the high-stress exponents are anomalously high ...the high-stress exponent has a strong ...
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BGA Jointing Property of Sn 8 8 mass%Zn and Sn 8 0 mass%Zn 3 0 mass%Bi Solder on Electroless Nickel Phosphorus/Immersion Gold Plated Substrates*
... for high-density mounting. Solder ball of conven- tional Sn–Pb alloy has been used to connect BGA package on printed circuit board ...of solder as surface finishing for PCB of ...
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Sn Ag Based Solders Bonded to Ni P/Au Plating: Effects of Interfacial Structure on Joint Strength
... eutectic Sn-Pb solder, which is commonly used, is environ- mentally harmful and can potentially affect human ...eutectic Sn-Pb solder are the Sn-Ag based ...their ...
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Microstructure and Strength of Sn Bi Coated Sn 3 5 mass%Ag Solder Alloy
... alloys have comparable wettability and thermo-mechanical reliability and are considered to be possible candidates for applying the soldering process in electronics. However, these solder alloys have higher melting ...
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Fatigue Damage Evaluation by Surface Feature for Sn 3 5Ag and Sn 0 7Cu Solders
... its high magnification (b) and a striking surface deformation (c) on the solder tested, ...of Sn–0.7Cu and Sn–37Pb solders were shown in ...at high magnification on the surface of ...
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Fatigue Reliability Evaluation for Sn Zn Bi and Sn Zn Lead Free Solder Joints
... of Sn–37Pb eutectic solder with the fatigue strength of Sn–Zn–(Bi) solder, the authors carried out a mechanical fatigue test for ...treated Sn–37Pb solder decreases a little in ...
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IMC Growth of Solid State Reaction between Ni UBM and Sn 3Ag 0 5Cu and Sn 3 5Ag Solder Bump Using Ball Place Bumping Method during Aging
... in high-density, high-speed technologies for semiconductor devices in recent years, high performance and substantial downsizing of electronic equipment have been ...eutectic Sn–Pb ...
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Temperature Effect on Tensile Behaviour of Sn Pb Eutectic Solder
... of Sn-Pb eutectic bulk solder ...the high temperature which may be encountered in high-power electrical devices, the temperature of interest in the present study ranges from -50°C to ...
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Transmission Electron Microscopy of Interfaces in Joints between Pb Free Solders and Electroless Ni P*
... of solder joint of Sn–Ag/Ni–P to UBM, at a low magnification, and concentration profiles of Sn, Ni, Ag and P, obtained at points 1–9 by EDX analysis, across the joint, ...the solder and/or Ni–P ...
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Interfacial Properties of Zn Sn Alloys as High Temperature Lead Free Solder on Cu Substrate
... Conventional high temperature solders have been high lead-bearing alloys, typically 85– 97 mass%Pb–Sn, and Au- or Bi-based ...eutectic Sn–37 ...of high lead-bearing solders have ...
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To Investigate the Thermal and Mechanical Properties of Bismuth Doped SAC Solder
... The solder material used for soldering need to have acceptable properties of wettability, thermal behaviour, mechanical properties such as tensile strength and low ...regulations, Sn-Pb alloys had ...
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Flip Chip Bump Formation of Sn 1 8Bi 0 8Cu 0 6In Solder by Stencil Printing
... mm Sn–Pb BGA ...in Sn–Pb after 1 min reflow was about ...with Pb- free solder is much faster than with Sn–Pb solder because of the high content of ...
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Melting and Joining Behavior of Sn/Ag and Sn Ag/Sn Bi Plating on Cu Core Ball
... joining, solder balls were dipped into rosin flux and then planted on the pads ...The solder balls were re- flowed by using a hot air ...the solder balls to melt was 90 s. After reflowing the ...
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Effect of Zn Addition on Interfacial Reactions Between Sn Bi Solder and Cu Substrate
... eutectic Sn-58Bi solder used in this study was a com- mercially available Sn-Bi solder ...The Sn-Bi-Zn solder alloy was prepared in-house by dissolving a Zn wire ...molten ...
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Pb-Free Sn-Ag-Cu-Mn Solder
... A solder alloy comprises Sn, Ag, Cu, and Mn and has a melting temperature of about 211 degrees ...A solder joint and solder process embody the solder alloy as well as solder ...
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Consumption of Soldering Iron by Pb Free Solder
... retained solder (position › in ...one solder- ing cycle flakes off during compressed air cleaning, resulting in the consumption of the soldering ...retained solder after compressed air cleaning ...
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