I-V Data Summarized for Thermal Gate Oxides
A I DM. W/ C V GS Gate-to-Source Voltage ± 16. Thermal Resistance Symbol Parameter Typ. Max. Units
11
Thermal Conductivity of Group-III Nitrides and Oxides.
194
Lanthanide-based Oxides and Silicates for High-K Gate Dielectric Applications
192
Heavy-ion-induced breakdown in ultra-thin gate oxides and high- k dielectrics
9
Catalytic Behaviour of Mixed Metal Oxides of Ln2MO4 for the Thermal Degradation of Urea
7
Gate recess study for high thermal stability pHEMT devices
5
Thermal Stability of Transition Metal Nitrides as NMOS Gate Electrodes
127
W/ C V GS Gate-to-Source Voltage ± 20 dv/dt Peak Diode Recovery f 5.0. V/ns T J. mj I AR. Thermal Resistance Symbol Parameter Typ. Max.
8
Alkaline earth rhodium hydroxides : synthesis, structures and thermal decomposition to complex oxides
22
Structure and thermal reactivity of some 2 substituted 1,3 oxathiolane S oxides
19
Samarium oxide and samarium oxynitride thin film gate oxides on silicon substrate / Goh Kian Heng
242
Optimization of nitrided gate dielectrics by plasma-assisted and rapid thermal processing
9
Process development and reliability of thin gate oxides
188
The data is summarized in the following tables
Electrical and thermal failure modes of 600 V p gate GaN HEMTs
6
A I DM. W/ C V GS Gate-to-Source Voltage ± 12. Thermal Resistance Symbol Parameter Typ. Max. Units
10
Investigation of Sputtered Hafnium Oxides for Gate Dielectric Applications in Integrated Circuits
206
Pressure Locking & Thermal Binding In Wedge Gate & Parallel Slide Gate Valves
20
Mock GATE -I(CSE)
12
revengc: An R package to Reverse Engineer Summarized Data
10