Cu substrate
Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating
... the Cu wire/CuSn intermetallic compound interface and the CuSn intermetallic compound/Cu substrate ...the Cu wire/CuSn intermetallic compound boundary located at the crystal grain ...
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Effect of Zn Addition on Interfacial Reactions Between Sn Bi Solder and Cu Substrate
... the Cu substrate, ele- mental-mapping analysis was performed using EPMA and the results are shown in ...of Cu-Zn-Sn has been formed between the Sn-Bi-Zn solder and the Cu ...Sn, Cu, and ...
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Interfacial Reaction and Morphology Between Molten Sn Base Solders and Cu Substrate
... happened in the Sn base solder/Cu substrate couples. This type of structure may be explained by the grooves which formed on the free surface of polycrystalline alloys due to the energy balance between the ...
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Interfacial Reactions Between Sn 58 mass%Bi Eutectic Solder and (Cu, Electroless Ni P/Cu) Substrate
... Ni–P/Cu) substrate were investigated at temperature between 70 and 120 ◦ C for 1 to 60 ...of Cu 6 Sn 5 and Ni 3 Sn 4 intermetallic compound in the couple of the ...
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Wettability of Sn Zn, Sn Ag Cu and Sn Bi Cu Alloys on Copper Substrates
... a Cu substrate was measured by the sessile drop method in Ar ...a Cu substrate because Zn is oxidized by the atmosphere, resulting in ZnO covering the surface of the ...
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Electrodeposition of Tin Based Film on Copper Plate for Electrocatalytic Reduction of Carbon Dioxide to Formate
... seen from the inset of Fig. 1b that there has no impurity on the surface of the Cu substrate after electropolishing. Fig. 1c gives the morphology of the Sn based film on the Sn/Cu electrode, which ...
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Corrosion behaviour and morphological analysis of Ni/Cu nanolayer coating in salt solution
... Cu substrate, at pH 4 and temperature of 23 ° C. A direct current (DC) power supply was used to provide consistent current during the electrodeposition process. The production of different sublayer ...
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Secondary Transferring Graphene Electrode for Stable FOLED
... that Cu substrate crystallography affects graphene nucleation and growth more than facet roughness by growing gra- phene on polycrystalline Cu with different crystal direction, coming to the ...
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Effect of Mass Fraction of Ni in Solution on the Microstructure and Sensitivity of Cu/Ni Film as Low Temperature Sensor
... on Cu substrate by varying the mass fraction of Ni in solution influences the thickness of Ni film, microstructure, and sensitivity of Cu/Ni as a low-temperature ...of Cu/Ni depends not only ...
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Infrared Reflection Absorption Study for Carbon Monoxide Adsorption on Chromium Deposited Cu(100) Surfaces
... sputtering and annealing, Cu(100) (<1 miscut) crystal surfaces were cleaned under ultra-high vacuum (UHV) conditions. The cleanliness and crystallographic order were verified using Auger electron spectroscopy ...
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Influence of Noble Metal Coating on Wettability of Copper Substrate by Sn Ag Eutectic Solder
... the Cu-Sn intermetallic compound was formed at the solder/ substrate interface as well as on the uncoated Cu substrate, but the coating metal layers remained on the unwetted ...the Cu ...
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Field Studies of Corrosion Behaviour of printed circuit board and hot air solder levelling During the Marine Environment of Industrial Pollution
... in Cu substrate directly exposing to the atmosphere, as was shown ...while Cu was little on the ...that Cu content increased, which suggested that Cu has been directly exposed to ...
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Interfacial Nano Mechanical Properties of Copper Joints Bonded with Silver Nanopaste near Room Temperature
... for Cu to Cu bonding at 60°C near room temperature without external bonding ...and Cu-Ag formed metal- lurgical ...at Cu-Ag interface was determined and its maximum nano-hardness was ...for ...
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FINAL Microstructure-Property Study of Cu1-xTax Thin Films
... Scratch resistance testing determines the critical load at which a surface will scratch or begin to delaminate. For the scratch resistance test, two tests were performed on each sample. The load was increased as a ...
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Residual Stress in Cu Sputtered Films on Glass Substrates at Different Substrate Temperatures
... between Zone I/Zone T and Zone II, as it is discussed by many authors [e.g., 4], the increase in the substrate temperature causes activation of other processes (e.g., diffusion, causing reduction in the number of ...
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Laser Deposition of (Cu + Mo) Alloying Reinforcements on AA1200 Substrate for Corrosion Improvement.
... Laser surface alloying (LSA) is an advanced processing technology that has potential to deposit various metallic and ceramic powdery materials locally on surfaces. Reports indicated that it can be used to improve ...
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Characteristics and Mechanism of Cu Films Fabricated at Room Temperature by Aerosol Deposition
... The rapid growth of wireless communications as well as the use of ubiquitous technology has led to a dramatic increase of interest in the design and fabrication of mini- aturized RF/microwave devices [1]. In particular, ...
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Comparative study of initial stages of copper immersion deposition on bulk and porous silicon
... of Cu immersion deposition on PS consisting of ordered cylindrical pores which are perpendicularly oriented to the surface of the original Si substrate ...of Cu immersion deposition on the surface of ...
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Conductive and Porous SnCu-Coated Carbon Cloth Network for Binder-free Li-Ion Storage Anodes
... electrically conductive, porous, flexible and mechanically stable CuSn alloy anode results. The CuSn anodes exhibited high conductivity due to copper deposit, accommodated volume changes and stress due to both ...
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Enhancement of Effective Accumulation of Atoms during Fabrication of Al Microsphere
... has been optimized during the experiment and is shown in Figure 2(b). The current stressing time over the experiment was 1860s. Here four specimens with a sudden change in geometrical shape were used under the same ...
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