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Accumulative roll bonding of pure copper and IF steel

Accumulative roll bonding of pure copper and IF steel

... Copyright © 2014 Saeed Tamimi et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the ...

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Erosion-Corrosion Behavior of Nano-Structured Pure Copper under Different Flowing Velocities

Erosion-Corrosion Behavior of Nano-Structured Pure Copper under Different Flowing Velocities

... Equal Channel Angular Pressing (ECAP) is considered one of the Severe Plastic Deformation (SPD) processes suitable for producing Nano-crystalline bulk materials. Processing by (ECAP) has become a recognized technique for ...

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Joining Of AA 6063 To Pure Copper Using Green Welding Technique

Joining Of AA 6063 To Pure Copper Using Green Welding Technique

... The measured readings were drawn as a graph which is shown in the fig 9. From the results it was observed that hardness values at the stir zone is less than other portions of the workpiece. The values on the aluminum ...

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Equal Channel Angular Pressing to Produce Ultrafine Pure Copper with Excellent Electrical and Mechanical Properties

Equal Channel Angular Pressing to Produce Ultrafine Pure Copper with Excellent Electrical and Mechanical Properties

... commercially pure copper samples were severely deformed by equal channel angular pressing (ECAP) up to eight passes at room ...the copper were ...the pure copper in each pass were ...

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Texture Changes during Simple Shear Extrusion (SSE) Processing of Pure Copper

Texture Changes during Simple Shear Extrusion (SSE) Processing of Pure Copper

... In the present work the texture evolution of pure copper during and after the first pass of simple shear extrusion tech- nique was investigated by EBSD observations. For this rea- son, samples were taken ...

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Misorientation Change of the Grain Boundary in Pure Copper Bicrystals Subjected to One Pass Equal Channel Angular Pressing

Misorientation Change of the Grain Boundary in Pure Copper Bicrystals Subjected to One Pass Equal Channel Angular Pressing

... study, pure copper bicrystals have been pressed by ECAP for one pass focusing on the influence of the slip pattern, the geometry of GB plane and the shear plane of ECAP on misorientation change of the ...

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Cellular Automata Modeling of Grain Coarsening and Refinement during the Dynamic Recrystallization of Pure Copper

Cellular Automata Modeling of Grain Coarsening and Refinement during the Dynamic Recrystallization of Pure Copper

... In this study, a cellular automata technique was developed to simulate a dynamic recrystallization process of pure copper. Moore’s neighboring rule was applied with partial fraction and time step control in ...

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Grain Boundary Structure of Ultrafine Grained Pure Copper Fabricated by Accumulative Roll Bonding

Grain Boundary Structure of Ultrafine Grained Pure Copper Fabricated by Accumulative Roll Bonding

... grained pure copper (Cu) fabricated by the accumulative roll bonding (ARB) have been ...in pure Cu were computed by molecular dynamics simulation ...

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Influence of Hardening on the Cyclic Plastic Zone Around Crack Tip in Pure Copper CT Specimens

Influence of Hardening on the Cyclic Plastic Zone Around Crack Tip in Pure Copper CT Specimens

... In this study, the effects of the nonlinear kinematic hardening on the shapes and CPZSs were investigated using finite element simulation. Analytical and nu- merical solutions based on the monotonic loading be- havior can ...

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Experimental and Theoretical Study of Hardness and Grain Size Variation in Cold Upset for Pure Copper Cylinder

Experimental and Theoretical Study of Hardness and Grain Size Variation in Cold Upset for Pure Copper Cylinder

... Abstract In this work, the influence of varied deformation percentages on the hardness and grain size, effective strain variation during simple upsetting is studied. Also, hardness variation in a typical cold upset ...

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Strain Controlled Fatigue Behavior in Thin Pure Copper Sheet for Smart Stress Memory Patch

Strain Controlled Fatigue Behavior in Thin Pure Copper Sheet for Smart Stress Memory Patch

... thin pure copper sheet was investigated under strain-controlled testing to evaluate the sensor characteristics when the patch is attached to ...(ED) copper of ...

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Change in Microstructure and Texture during Annealing of Pure Copper Heavily Deformed by Accumulative Roll Bonding

Change in Microstructure and Texture during Annealing of Pure Copper Heavily Deformed by Accumulative Roll Bonding

... Pure copper sheets were heavily deformed up to equivalent strain of ...processed copper showed the ultra-fine grained microstructure which consisted of relatively equiaxed grains having grain ...

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Synthesis and Characterization of Pure Copper Nanostructures Using Wood Inherent Architecture as a Natural Template

Synthesis and Characterization of Pure Copper Nanostructures Using Wood Inherent Architecture as a Natural Template

... study, pure copper nanoparticles were synthesized using poplar wood as a natural inexpensive and renewable ...the copper nanoparticles were characterized by X-ray diffraction and field emission ...

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Magnetically Retarded Recovery and Recrystallization in Cold Rolled Pure Copper

Magnetically Retarded Recovery and Recrystallization in Cold Rolled Pure Copper

... The effects of magnetic field annealing on the micro-hardness and recrystallization microstructures in a cold-rolled pure copper sheet were studied. The results showed that the micro-hardness in the ...

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Effect of Roll Bonding and Subsequent Annealing on Microstructure Evolution of Accumulative Roll Bonded Pure Copper

Effect of Roll Bonding and Subsequent Annealing on Microstructure Evolution of Accumulative Roll Bonded Pure Copper

... The {111} pole figures of ARB processed 4N-Cu with and without lubrication are shown in Fig. 6. As can be seen in Fig. 6(q), ARB 0c has Cube {001}<100> texture which is known as rolling and recrystallization ...

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Corrosion inhibition of pure copper using Pisonia Grandis leaves extract in acid Environment

Corrosion inhibition of pure copper using Pisonia Grandis leaves extract in acid Environment

... Historically, copper was the first metal to be used by ...gold. Copper is easily stretched, moulded, shaped and conducts heat and electricity more ...result, copper was important to early humans and ...

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Study of Microstructure & Mechanical Properties on Pure Aluminum & Pure Copper Joint by Friction Stir Welding Process

Study of Microstructure & Mechanical Properties on Pure Aluminum & Pure Copper Joint by Friction Stir Welding Process

... The axial force during friction stir welding is sensitive to plunge depth of the tool and is one of the prime factors, which exercises control over heat generation during welding. Consequently, the plunge depth for a ...

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Investigation into high-frequency-vibration assisted micro-blanking of pure copper foils

Investigation into high-frequency-vibration assisted micro-blanking of pure copper foils

... The commercial rolled T2 copper foil of 100 m in the thickness was chosen for the investigation. To eliminate the hardening induced during the production of the rolled foil, the copper foil was annealed ...

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Shear Fracture Behavior on Ball Grid Arrayed Tin  Silver  Copper Solder/Pure Copper Pad Joint Interface

Shear Fracture Behavior on Ball Grid Arrayed Tin Silver Copper Solder/Pure Copper Pad Joint Interface

... strength obtained by these conventional tests using print board cannot be evaluated correctly because the fracture occurs on only solders side, not on joint interface. Commer- cial print board is covered with resist ...

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Joining of Pure Copper Using Cu Nanoparticles Derived from CuO Paste

Joining of Pure Copper Using Cu Nanoparticles Derived from CuO Paste

... A paste containing CuO particles and polyethylene glycol 1000 as a reducing solvent has been applied to joining pure Cu in electronic applications, and the bondability of the joints and bonding mechanism were ...

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