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ball grid array (BGA)

Bonding Characteristics of Underfilled Ball Grid Array Packaging

Bonding Characteristics of Underfilled Ball Grid Array Packaging

... years, ball grid array (BGA) package has been widely used in the portable electronic device, which can offer miniaturization and increased functional ...

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Creep Response of Various Solders used in Soldering Ball Grid Array (BGA) on Printed Circuit Board (PCB)

Creep Response of Various Solders used in Soldering Ball Grid Array (BGA) on Printed Circuit Board (PCB)

... Abstract—In electronics packaging, solder joints play a critical role by providing electrical, thermal and mechanical connections between the package and the printed circuit board (PCB). As the joint is both miniature ...

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Modeling and Mode Shape Extraction of Ball Grid Array Package on Printed Circuit Board Soldered using Lead Free Solder Alloy – SAC405

Modeling and Mode Shape Extraction of Ball Grid Array Package on Printed Circuit Board Soldered using Lead Free Solder Alloy – SAC405

... The ball grid array (BGA) package has become a foremost packaging type in previous years, because of its high capability for the input/output (I/O) ...solder ball and pin is present which is ...

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Modeling and Mode Shape Extraction of Ball Grid Array Package on Printed Circuit Board Soldered using Lead Free Solder Alloy  SAC405

Modeling and Mode Shape Extraction of Ball Grid Array Package on Printed Circuit Board Soldered using Lead Free Solder Alloy SAC405

... The ball grid array (BGA) package has become a foremost packaging type in previous years, because of its high capability for the input/output (I/O) ...solder ball and pin is present which is ...

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Influence of Underfill on Ball Grid Array (BGA) Package Fatigue Life

Influence of Underfill on Ball Grid Array (BGA) Package Fatigue Life

... modulus underfill significantly reduces solder strain. Hung et al. (2000) underfilled the solder joints with 15 packages of flex type BGA and tested for more than 8 months in a test chamber and found no defects in the ...

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Factors identification on optimization of ball placement tool for flip-chip- ball-grid-array product

Factors identification on optimization of ball placement tool for flip-chip- ball-grid-array product

... in ball-attach assembly has 3 process step, there are 1) Fluxing, 2) Ball Placement and then 3) Reflow ...on ball- placement equipment is focused. From the other sub- module, ball-attach ...

5

The Investigation of Die Back Edge Cracking in Flip Chip Ceramic Ball Grid Array Package (FC-CBGA)

The Investigation of Die Back Edge Cracking in Flip Chip Ceramic Ball Grid Array Package (FC-CBGA)

... This study has presented a FEA simulation based, comparison in underfill fillet geometry and underfill material properties in investigation the die back edge cracking in FC-[r] ...

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Lattice boltzmann and finite volume simulations of multiphase flow in 
		bga encapsulation process

Lattice boltzmann and finite volume simulations of multiphase flow in bga encapsulation process

... This project is related to 3-dimensional fluid flow simulation through a ball grid array (BGA). Figure-2 depicts the schematic diagram of under fill process for the flow. The BGA consists of square ...

7

A Compact Package with Integrated Patch Antenna for Single-Chip 60-GHz
 Radios

A Compact Package with Integrated Patch Antenna for Single-Chip 60-GHz Radios

... land grid array (LGA) packaging solution for a 60-GHz radio chipset has been reported ...A ball grid array (BGA) package together with a flip-chip attached 60-GHz transmitter or ...

12

An Overall LTCC Package Solution for X-Band Tile T/R Module

An Overall LTCC Package Solution for X-Band Tile T/R Module

... Abstract—An overall Low-Temperature Co-fired Ceramics (LTCC) package solution for X-band T/R module has been presented in this paper. This tile type package contributes to a dramatic reduction in size and weight of the ...

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Finite Element Analysis of Mechanical Stress in Flip Chip Ball Grid Array using 
              ABAQUS

Finite Element Analysis of Mechanical Stress in Flip Chip Ball Grid Array using ABAQUS

... solder ball and propagated towards center solder ...solder ball is directly proportional with the applied loads whereas there is just a small increment in stress level for center ball with increasing ...

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Designing Parameters and Study of 8 KW Solar PV Grid Connected System (A Case Study)

Designing Parameters and Study of 8 KW Solar PV Grid Connected System (A Case Study)

... Abstract: - The purpose of this paper is to provide the real information about 8KW Solar Photo Voltaic System. The conventional energy sources like coal, petroleum and fossil fuels are limited in nature. About 55% of ...

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Antenna array (design at 28 GHz for 5G mobile network)

Antenna array (design at 28 GHz for 5G mobile network)

... Laszlo Kiss, Paul B Bennett, Victor N Uebele, Kenneth S Koblan, Stefanie A Kane, Brad Neagle, and Kirk Schroeder. (2003). 'High Throughput Ion-Channel Pharmacology: Planar-Array-Based Voltage Clamp', Assay and ...

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A Novel Microstrip Grid Array Antenna with Both High-Gain and Wideband Properties

A Novel Microstrip Grid Array Antenna with Both High-Gain and Wideband Properties

... microstrip grid-array antennas, the proposed antenna’s grid array is formed by two kinds of microstrip lines, which are short (X-directed) and long (Y -directed) sides of grid ...

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Modeling and control of MPPT Based Grid Connected  Wind-PV Hybrid Generation System
                 

Modeling and control of MPPT Based Grid Connected Wind-PV Hybrid Generation System  

... conventional grid supplies, while other homeowners who choose the renewable energy sources prefer to connect their energy system to the grid ...photovoltaic array model for use in power-electronics ...

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Off
-Grid Direction-of-Arrival Estimation Using a Sparse Array Covariance Matrix

Off -Grid Direction-of-Arrival Estimation Using a Sparse Array Covariance Matrix

... the array covariance matrix to improve its ...sampling grid), and they are built upon the principle of sparse signal reconstruction in the presence of the off-grid problem introduced in ...

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A Unified Neural Coherence Model

A Unified Neural Coherence Model

... Table 4 presents the results in accuracy on the two “global” discrimination tasks – the Standard and the Inverse order discrimination. The reported re- sults of the entity-grid models are from the origi- nal ...

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1.
													Mppt techniques for efficient solar grid interfaced system

1. Mppt techniques for efficient solar grid interfaced system

... solar grid interfaced system is shown in the ...PV array, two boost converter one is the MPPT boost converter and the other one is boost converter on the grid side, voltage source inverter and a ...

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Is Youth Baseball Safe? A Computational and Experimental Examination into Reducing Youth Baseball Injury Potential.

Is Youth Baseball Safe? A Computational and Experimental Examination into Reducing Youth Baseball Injury Potential.

... The second type of injury prevalent in baseball, and alarmingly so in youth baseball, is chronic overuse arm injury [2]. The mechanism for injury has been studied in great detail and overuse arm injuries are believed to ...

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Pressure fields in the vicinity of brass musical instrument bells measured using a two dimensional grid array and comparison with multimodal models

Pressure fields in the vicinity of brass musical instrument bells measured using a two dimensional grid array and comparison with multimodal models

... an array of 1/4” Roga RG-50 microphones microphones in the anechoic chamber of at the Institute of Musical Acoustics in the University of Music and Performing Arts of ...

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